Nano-Silver Bridges Help Copper Hybrid Cut LED Thermal Resistance by 44% in ssalimpour

Salimpour Website |Researchers used sub-10-nm silver nanoparticles to bridge copper microparticles and silver nanoflakes, creating a micro-nano hybrid thermal interface material with a thermal conductivity of 330.0 W/(m·K). In a model LED package, the nano-enabled hybrid reduced effective

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Nano-Silver Bridges Help Copper Hybrid Cut LED Thermal Resistance by 44%

Nano-Silver Bridges Help Copper Hybrid Cut LED Thermal Resistance by 44%

Researchers used sub-10-nm silver nanoparticles to bridge copper microparticles and silver nanoflakes, creating a micro-nano hybrid thermal interface material with a thermal conductivity of 330.0 W/(m·K). In a model LED package, the nano-enabled hybrid reduced effective die-attach thermal resistance by 44% compared with a commercial silver paste while using less silver.