Structure-Property Relationship of Electroplated Cu Film by Combining Electron Backscatter Diffraction (EBSD) and in ssalimpour

Salimpour Website |High-speed nanoindentation and EBSD techniques are employed to analyze self-annealed electroplated Cu, highlighting spatial variations in mechanical properties.

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Structure-Property Relationship of Electroplated Cu Film by Combining Electron Backscatter Diffraction (EBSD) and High-Speed Nanoindentation Techniques

Structure-Property Relationship of Electroplated Cu Film by Combining Electron Backscatter Diffraction (EBSD) and High-Speed Nanoindentation Techniques

High-speed nanoindentation and EBSD techniques are employed to analyze self-annealed electroplated Cu, highlighting spatial variations in mechanical properties.